Adhesive Bond Inspection System

Adhesive bonding technology is playing an increasingly important role in a range of applications. Particularly in the automotive and aerospace industries. For such applications, it is crucial that a bond is manufactured free of defects and that the adhesive is of uniform composition. Thus, nondestructive testing (NDT) of the adhesive joints is of great importance.

Tessonics Single Element Adhesive Bond Analyzer was developed for quality control and NDT of adhesive joints in automotive and aerospace assemblies. This system acquires, displays and records bond integrity data over designated critical regions of the bond joints of each assembly or subassembly, and provides accept/reject indications, according to established criteria, for pre-cured and post-cured adhesive bond joints. The device is capable of detecting adhesive on the internal sides of the first / second metal sheets, and delaminations inside the adhesive layer.

Features

• One side access
• Real time A–scan display
• Real time evaluation of bonding quality at both interfaces of the adhesive layer
• Lateral resolution – 6 mm

Applications

Metal: steel and aluminum 0.7 – 2.0 mm thickness

Adhesive: 0.1 – 1 mm thickness